Colloidal Silica is composed of very fine solid particulate matter (typically between 0.1 and 0.001 microns in diameter) which, when suspended in water will neither be settled nor be filtered.

Colloidal Silica is non-ionic, and is often called non-reactive silica.

It is essential to remove colloidal silica from water to be used in semiconductor applications and high pressure boiler operations.

The Purolite^® resin recommended for this application is:
A501P

Loading factors are typically determined by bench or pilot testing. Purolite^® A501P is regenerated with caustic soda.

Typically, Purolite^® A501P would be used as the polisher for existing Strong Base Anion silica removal application, and regeneration, with caustic soda, should be at the same temperature as required for the SBA resin.